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309 entries « 7 of 7 »

2003

Minor, A. M.; Stach, E. A.; Jr., J. W. Morris; Petrov, I.

In-situ nanoindentation of epitaxial TiN/MgO (001) in a transmission electron microscope Journal Article

In: Journal of Electronic Materials, vol. 32, no. 10, pp. 1023-1027, 2003, (cited By 31).

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Minor, A. M.; Lilleodden, E. T.; Jin, M.; Stach, E. A.; Chrzan, D.; Jr., J. W. Morris; Friedmann, T. A.; Xiao, X.; Auciello, O. H.; Carlisle, J. A.

In-situ nanoindentation – A unique probe of deformation response in materials Journal Article

In: Microscopy and Microanalysis, vol. 9, no. SUPPL. 2, pp. 900-901, 2003, (cited By 1).

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2002

Minor, A. M.; Lilleodden, E. T.; Stach, E. A.; Morris, J. W.

In-situ transmission electron microscopy study of the nanoindentation behavior of Al Journal Article

In: Journal of Electronic Materials, vol. 31, pp. 958-964, 2002, (cited By 49).

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Minor, A. M.; Lilleodden, E. T.; Stach, E. A.; Jr., J. W. Morris

A method for extracting quantitative data during in-situ TEM nanoindentation Conference

vol. 695, 2002, (cited By 0).

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2001

Stach, E. A.; Freeman, T.; Minor, A. M.; Owen, D. K.; Cumings, J.; Wall, M. A.; Chraska, T.; Hull, R.; Jr., J. W. Morris; Zettl, A.; Dahmen, U.

Development of a nanoindenter for in situ transmission electron microscopy Journal Article

In: Microscopy and Microanalysis, vol. 7, no. 6, pp. 507-517, 2001, (cited By 92).

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Minor, A. M.; Jr., J. W. Morris; Stach, E. A.

Quantitative in situ nanoindentation in an electron microscope Journal Article

In: Applied Physics Letters, vol. 79, no. 11, pp. 1625-1627, 2001, (cited By 138).

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Song, H. G.; Ahn, J. P.; Minor, A. M.; Morris, J. W.

Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallization Journal Article

In: Journal of Electronic Materials, vol. 30, no. 4, pp. 409-414, 2001, (cited By 37).

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2000

Minor, A. M.; Morris, J. W.

Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization Journal Article

In: Journal of Electronic Materials, vol. 29, no. 10, pp. 1170-1174, 2000, (cited By 68).

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Minor, A. M.; Morris, J. W.

Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging Journal Article

In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, vol. 31, no. 3, pp. 798-800, 2000, (cited By 80).

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309 entries « 7 of 7 »